Junction and Material Properties of n-Cu2 O/P-Cul based Heterojunction Fabricated by Low-Cost Methods

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dc.contributor.authorNisansi, I. W. R
dc.contributor.authorJayalath, I. S
dc.contributor.authorPitigala, P. K. D. D. P.
dc.date.accessioned2022-09-14T10:38:50Z
dc.date.available2022-09-14T10:38:50Z
dc.date.issued2020
dc.identifier.citationNisansi, I. W. R., Jayalath, I. S. & Pitigala, P. K. D. D. P. (2020). Junction and Material Properties of n-Cu2 O/P-Cul based Heterojunction Fabricated by Low-Cost Methods. Proceeding of the Technical Session. 2020en_US
dc.identifier.urihttp://dr.lib.sjp.ac.lk/handle/123456789/12269
dc.language.isoenen_US
dc.publisherProceeding of the Technical Sessionen_US
dc.titleJunction and Material Properties of n-Cu2 O/P-Cul based Heterojunction Fabricated by Low-Cost Methodsen_US
dc.typeArticleen_US

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