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Junction and Material Properties of n-Cu2 O/P-Cul based Heterojunction Fabricated by Low-Cost Methods

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dc.contributor.author Nisansi, I. W. R
dc.contributor.author Jayalath, I. S
dc.contributor.author Pitigala, P. K. D. D. P.
dc.date.accessioned 2022-09-14T10:38:50Z
dc.date.available 2022-09-14T10:38:50Z
dc.date.issued 2020
dc.identifier.citation Nisansi, I. W. R., Jayalath, I. S. & Pitigala, P. K. D. D. P. (2020). Junction and Material Properties of n-Cu2 O/P-Cul based Heterojunction Fabricated by Low-Cost Methods. Proceeding of the Technical Session. 2020 en_US
dc.identifier.uri http://dr.lib.sjp.ac.lk/handle/123456789/12269
dc.language.iso en en_US
dc.publisher Proceeding of the Technical Session en_US
dc.title Junction and Material Properties of n-Cu2 O/P-Cul based Heterojunction Fabricated by Low-Cost Methods en_US
dc.type Article en_US


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